GaN Systems Industrial Articles

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Richardson RFPD Announces Agreement with GaN Systems

Agreement aligns expansion efforts in gallium nitride adoption for power-conversion applications May, 2016 – Geneva, Ill.: Richardson RFPD, Inc. today announced an agreement with GaN Systems Inc. Under the terms of the agreement, Richardson RFPD will sell GaN Systems’ GaN on Si power devices on a global basis, excluding Israel. GaN Systems manufactures a range…

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Imperial College London Wins GaN Systems Geoff Haynes Future Power Challenge

GaN Systems teams with the UK EPSRC Power Electronics Centre to accelerate the use of high speed GaN transistors in future power conversion or control applications Nottingham, England – At a ceremony held at the EPSRC Centre for Power Electronics Annual Conference 2016 in Nottingham, England, a post-graduate team from Imperial College London received the…

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Integration or Optimization…Which Comes First?

At APEC 2016 it became abundantly clear to the industry that GaN transistors are here, they’re now, and they’re proliferating. GaN Systems, EPC, Transphorm, Panasonic, Infineon, Texas Instruments, and other manufacturers and developers all displayed GaN products in varying readiness, from existing only on PowerPoint slides to actual customer production units. It’s been fascinating to watch…

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Google Little Box Challenge Showcases GaN Power Element

EDN describes how GaN is outperforming silicon in power management applications. This article describes how GaN transistors enabled CE+T’s Red Electrical Devils team to design the tour de force inverter that won Google’s Little Box Challenge. Their inverter produced a power density of 143 W/cubic inch in 14 cubic inches, outperforming the Little Box Challenge…

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Level 2 Onboard Charger with GaN Semiconductors Achieves Record Efficiency

Charging levels are headed higher, and greater efficiency could make it easier to top up tomorrow’s bigger batteries without straining the grid. Researchers at the Advanced Power Electronics Lab at Kettering University, in partnership with auto electronics giant HELLA, now report that they have built a Level 2 onboard charger with an efficiency of 97%,…

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Podium Session at PCIM Europe Marks New Chapter in GaN Power Device Adoption

Over the years, GaN power has been sarcastically described as “the technology of the future…and always will be.”  While silicon carbide devices have been gaining a stronger beachhead in displacing IGBTs in higher voltage applications, the evolution of GaN as a cost-effective alternative to Si MOSFETs in applications from 200V up through 600V was, in…

Getting started with the GS66508T-EVBHB 650 V half bridge evaluation board

Getting started with the GS66508T-EVBHB 650 V half bridge evaluation board

GaN Systems’ Di Chen explains how to test 650 V GaN transistors for your application. Our eval board is easily configured into any half-bridge-based topology, including synchronous boost and buck conversion modes, as well as pulsed switching to evaluate transistor waveforms.

PSDtv - GaN Systems Shows Significant Size and Power Density Gains

GaN Systems Helps CE+T Win Google’s Little Box Challenge

That GaN transistors outperform silicon-based solutions has never been more convincingly demonstrated than by CE+T’s Red Electrical Devils, who won first place in Google’s Little Box Challenge. At APEC 2016, Girvan Patterson, President of GaN Systems, describes to Design World / EEWorld’s Lee Teschler CE+T’s winning design of an uber-compact inverter using GaN transistors. The…

PSDtv - GaN Systems Shows Significant Size and Power Density Gains

PSDtv – GaN Systems Shows Significant Size and Power Density Gains

G-Philos 700W GaN-based ESS is 30% smaller, 25% less power consumption than silicon version GaN Systems President Girvan Patterson describes a 1 kV energy storage system (ESS) from Korean-based customer G-Philos that stores solar-generated power and returns unconsumed power to the grid. The GaN-based design uses both 650 V and 100 V transistors, is up…

GaN Systems - GaNpx Packaging Process Flow

GaN Systems – GaNpx Packaging Process Flow

GaNpx packaging provides extreme speed and current with: 1) a near chipscale embedded package, 2) high current density & low profile, 3) optimal thermal performance, 4) extremely low inductance, and 5) no wirebonds. GaN Systems makes it easy for designers and systems engineers to adopt gallium nitride solutions.