GS P gan transistor

Not Recommended for New Designs.
For new designs, use  GS66508B

Part NumberGS66508P
Step File
Allegro Library
Altium Library

ECAD Model

RDS(on)50 mΩ
QG5.8 nC
Dimensions (mm)10.0 x 8.7 x 0.51


650V Enhancement Mode GaN Transistor

The GS66508P is an enhancement mode GaN-on-silicon power transistor. The properties of GaN allow for high current, high voltage breakdown and high switching frequency. GaN Systems implements patented Island Technology® cell layout for high-current die performance & yield. GaNPX® packaging enables low inductance & low thermal resistance in a small package. The GS66508P is a bottom-side cooled transistor that offers very low junction-to-case thermal resistance for demanding high power applications. These features combine to provide very high efficiency power switching.

  • Ultra-low FOM Island Technology® die
  • Low inductance GaNPX® package
  • Easy gate drive requirements (0 V to 6 V)
  • Transient tolerant gate drive (-20 V / +10 V)
  • Very high switching frequency (> 100 MHz)
  • Fast and controllable fall and rise times
  • Reverse current capability
  • Zero reverse recovery loss
  • Small 10.0 x 8.7 mm2 PCB footprint
  • Source Sense (SS) pin for optimized gate drive
  • RoHS 6 compliant


  • High efficiency power conversion
  • High density power conversion
  • AC-DC Converters
  • Bridgeless Totem Pole PFC
  • ZVS Phase Shifted Full Bridge
  • Half Bridge topologies
  • Synchronous Buck or Boost
  • Uninterruptable Power Supplies
  • Industrial Motor Drives
  • Single and 3Φ inverter legs
  • Solar and Wind Power
  • Fast Battery Charging
  • Class D Audio amplifiers
  • 400 V input DC-DC converters
  • On Board Battery Chargers
  • Traction Drive

Related Videos:

GaN Systems – GaNpx Packaging Process Flow

GaN Powered: Revolutionizing Today’s Most Power Demanding Industries

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