This horizontal Insulated Metal Substrate (IMS3) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX^® bottom-side cooled E-modes in high power applications. The optimized thermal and electrical designs provide an excellent reference for implementing a low cost, high performance design.

Compatibility

• GS-EVB-HBDB-IMS –  650 V Universal High-Power Half Bridge Driver Motherboard for IMS2 & IMS3
• GSP665HPMB-EVBIMS2 – 650 V Universal High-Power Dual Half Bridge / Full Bridge Driver Motherboard for IMS2 & IMS3

Features and Benefits

• Improved heat transfer
• Increased power density
• Reduced system cost
• High thermal conductivity (7.0 W/mK)
• IMS3 half bridge power boards are available in 2 power levels: 3 kW and 6 kW.

Applications

• Automotive: 3.3kW-22kW on board charger, DC/DC, 3-Φ inverter, high power wireless charger
• Industrial: 3-7kW Photovoltaic Inverter and Energy Storage System (ESS), Motor Drive / VFD
• Server/Datacenter: 3kW Server ACDC power supply.
• Consumer: Residential Energy Storage System (ESS)

IMS2 & IMS3 gate driver motherboards
GS-EVB-HBDB-IMS
GSP665HPMB-EVBIMS2

IMS3 half bridge evaluation boards
GS-EVB-IMS3-66508B-GS
GS-EVB-IMS3-66516B-GS
GS-EVB-IMS3-0650603B-GS