This horizontal Insulated Metal Substrate (IMS2) evaluation platform can be used to evaluate the electrical and thermal performance benefits of GaNPX^® bottom-side cooled E-HEMTs in low power applications. The optimized thermal and electrical designs provide an excellent reference for implementing a low cost, high performance design.

Features and Benefits

• Improved thermal design and power density
• Low-cost thermal solution for low power applications
• Ultra low inductance, bottom-cooled GaNPX^® package
• Minimized parasitics in the power and gate drive loops via magnetic flux-cancellation
• High performance switching with low EMI

Applications

• Industrial: AC-DC SMPS, appliance motor drives, VFD
• Data Center: Server AC/DC power supply
• Consumer: High power adapters, LED drivers

IMS2 platform gate driver motherboard

• GS-EVB-IMS2-LPMB

IMS2 half bridge evaluation boards

• GS-EVB-IMS2-66504B-GS
• GS-EVB-IMS2-06511L-GS