| Document # | App Notes |
|---|
| GN001 | An Introduction to GaN E-HEMTs |
| GN002
| Thermal Design for Packaged GaNPX® Devices |
| GN003 | Measurement Techniques for High-Speed GaN E-HEMTs |
| GN004 | Design considerations of paralleled GaN HEMT |
| GN006 | SPICE model for GaN HEMT usage guidelines and example |
| GN007 | Modeling Thermal Behavior of GaNPX® and PDFN packages Using RC Thermal SPICE Models |
| GN008 | GaN Switching Loss Simulation Using LTSpice |
| GN009 | PCB Layout Considerations with GaN E-HEMTs |
| GN010 | EZDriveTM Solution for GaN Systems E-HEMTs |
| GN011 | Soldering Recommendations for GaNPX® and PDFN Packaged Devices |
| GN012 | Gate Driver Design with GaN E-HEMTs |
