Application Notes
Our unique portfolio of GaN power transistors enables the design of smaller, lower cost, more efficient power systems that are free from the limitations of yesterday’s silicon. Our application guides and design examples will help you understand and get the most out of GaN Systems’ technology.
| Document # | Title |
|---|---|
| GN001 | Design with GaN Enhancement mode HEMT |
| エンハンスメントモードGaN-HEMTを用いたデザイン | |
| GN002 | Thermal Design for Top-Side Cooled GaNPX® packaged Devices |
| GN003 | Measurement Techniques for High-Speed GaN E-HEMTs |
| GN004 | Design considerations of paralleled GaN HEMT |
| GN005 | PCB Thermal Design Guide for GaN Enhancement Mode Power Transistors |
| GN006 | SPICE model for GaN HEMT usage guidelines and example |
| GN007 | Modeling Thermal Behavior of GaNPX® packages Using RC Thermal SPICE Models |
| GN008 | GaN Switching Loss Simulation Using LTSpice |
| GN009 | PCB Layout Considerations with GaN E-HEMTs |
| GN010 | EZDriveTM Solution for GaN Systems E-HEMTs |
| GN011 | Soldering Recommendations for GaNPX® Packaged Devices |
