GaN Systems Power & Energy Articles

GaN Systems – GaNpx Packaging Process Flow

GaNpx packaging provides extreme speed and current with: 1) a near chipscale embedded package, 2) high current density & low profile, 3) optimal thermal performance, 4) extremely low inductance, and 5) no wirebonds. GaN Systems makes it easy for designers and systems engineers to adopt gallium nitride solutions.

GaN Systems – Island Technology

The island structure is the core GaN Systems IP. It has the dual advantage of an up to four times reduction in the size and cost of gallium nitride devices, while transferring substantial current from the on-chip metal to a separate carrier. GaN Systems makes it easy for designers and systems engineers to adopt gallium…